US Patent Issued to Advanced Semiconductor Engineering on March 17 for "Semiconductor device packages including an inductor and a capacitor" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,668, issued on March 17, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor device packages including an inductor and a capacitor" was invented by Chien-Hua Chen (Kaohsiung, Taiwan) and Teck-Chong Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer co...