US Patent Issued to Advanced Semiconductor Engineering on March 17 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,954, issued on March 17, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor device package and method of manufacturing the same" was invented by Ying-Chung Chen (Kaohsiung, Taiwan) and Lu-Ming Lai (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a...