US Patent Issued to Advanced Semiconductor Engineering on June 30 for "Method of manufacturing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,498, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Method of manufacturing semiconductor structure" was invented by Bo Hua Chen (Kaohsiung, Taiwan), Yan Ting Shen (Kaohsiung, Taiwan), Tsung Chi Wu (Kaohsiung, Taiwan) and Tai-Hung Kuo (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a seco...