US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Feb. 17 for "Package structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,709, issued on Feb. 17, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Package structure and method for manufacturing the same" was invented by Wen Hung Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of...