ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,204, issued on Aug. 25, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).
"Method for manufacturing a package structure" was invented by Yu-Lin Shih (Kaohsiung, Taiwan) and Chih-Cheng Lee (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a package structure includes: providing a first electrical element and a second electrical element on a surface of a first carrier, wherein the second electrical element is shifted with respect to the first electrical element; and moving the first electrical element along at least one direction substantially parallel with the surface of the first ...