US Patent Issued to Advanced Semiconductor Engineering on Aug. 18 for "Semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,919, issued on Aug. 18, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor package structure" was invented by Hung-Hsien Huang (Kaohsiung, Taiwan), Wen Chun Wu (Kaohsiung, Taiwan) and Chih-Pin Hung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat sou...