US Patent Issued to Advanced Semiconductor Engineering, Universal Scientific Industrial (Shanghai) on Aug. 18 for "Power module packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,922, issued on Aug. 18, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan) and Universal Scientific Industrial (Shanghai) Co. Ltd. (Shanghai).

"Power module packaging structure" was invented by Chih-Ming Liu (Kaohsiung, Taiwan), Yung-Fa Chen (Nantou County, Taiwan) and Hung Cheng Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first si...