US Patent Issued to ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA on Aug. 4 for "Semiconductor processing chamber, semiconductor processing equipment and vapor epitaxy equipment" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,571, issued on Aug. 4, was assigned to ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA (Shanghai).

"Semiconductor processing chamber, semiconductor processing equipment and vapor epitaxy equipment" was invented by Heng Tao (Shanghai), Yunling Pang (Shanghai), Hai Cong (Shanghai), Yong Jiang (Shanghai) and Gerald Zhe Yao Yin (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are a semiconductor processing chamber, semiconductor processing equipment and vapor epitaxy equipment, solving technical problems of process gas uniformity, infrared radiation transmittance and pressure-bearing capacity in the field of semiconductor process...