US Patent Issued to Advanced Micro Devices on Sept. 8 for "Stacked die crossing" (Colorado, Texas Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,768, issued on Sept. 8, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Stacked die crossing" was invented by Richard Martin Born (Fort Collins, Colo.), Carl Dietz (Fort Collins, Colo.) and James Wingfield (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed systems and methods provide signal crossing across die boundaries of stacked dies. By having a queue structure coupled to a multiplexer hierarchy, clock skew and other differences between stacked dies can be addressed without require a prohibitive number of TSVs, BPVs, or other vertical interconnects. Various other methods, systems, and computer-readabl...