US Patent Issued to Advanced Micro Devices on June 16 for "3D layout and organization for enhancement of modern memory systems" (California, Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,703, issued on June 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"3D layout and organization for enhancement of modern memory systems" was invented by Divya Madapusi Srinivas Prasad (Mountain View, Calif.), Vignesh Adhinarayanan (Austin, Texas), Michael Ignatowski (Austin, Texas) and Hyung-Dong Lee (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Memory stacks having substantially vertical bitlines, and chip packages having the same, are disclosed herein. In one example, a memory stack is provided that includes a first memory IC die and a second memory IC die. The second memory IC die is stacked on the first me...