US Patent Issued to Advanced Micro Devices on July 28 for "Chip-on-wafer face-to-back hybrid bonding without support carrier" (Colorado, Texas Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,736, issued on July 28, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Chip-on-wafer face-to-back hybrid bonding without support carrier" was invented by Chandra Sekhar Mandalapu (Ft. Collins, Colo.), Raja Swaminathan (Austin, Texas), Liwei Wang (Austin, Texas) and John Wuu (Ft. Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hybrid bonding method includes fabricating plural semiconductor devices in a region of a bottom wafer adjacent to a front surface thereof, fusion bonding the front surface to a carrier substrate, thinning the bottom wafer opposite to the front surface to expose conductive regions of the semi...