US Patent Issued to ADVANCED MICRO DEVICES on Aug. 25 for "Structural thermal interfacing for lidded semiconductor packages" (California, Texas Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,159, issued on Aug. 25, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Structural thermal interfacing for lidded semiconductor packages" was invented by Priyal Shah (Santa Clara, Calif.), Raja Swaminathan (Austin, Texas) and Brett P. Wilkerson (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structural thermal interfacing for lidded semiconductor packages, including: applying, to a periphery of a surface of a chip, a stiffening adhesive framing a center portion of the chip; applying, to the center portion of the chip, a thermal interface material; and applying a lid to the chip, wherein the lid contacts the stiffeni...