US Patent Issued to Advanced Micro Devices, ATI Technologies on Nov. 3 for "Lid assembly for a chip package" (Canadian, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,856, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Lid assembly for a chip package" was invented by Suming Hu (Santa Clara, Calif.), Roden Topacio (Ontario, Canada), Manish Dubey (Austin, Texas) and Jianguo Li (Ontario, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a package substrate, an integrated circuit (IC) die disposed on the package substrate, and a lid assembly disposed over the IC die. The lid assembly includes a top plate having a lower surface facing the IC die and an outer shoulder. The lid assembly also includes a retainer h...