US Patent Issued to Advanced Micro Devices, ATI Technologies on July 28 for "Chip package having a stiffener and an electronic device having the same" (Canadian, Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,796, issued on July 28, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Chip package having a stiffener and an electronic device having the same" was invented by Zean Xia (Shanghai) and Jian Guo Li (Thornhill, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a package substrate having a top surface and a bottom surface. An integrated circuit ("IC") die is disposed on the top surface of the package substrate. The electronic device also includes a stiffener having a ring body and a plurality of support members. The ring body is secured to the top surface ...