US Patent Issued to Advanced Micro Devices, ATI Technologies on Feb. 24 for "Power via with reduced resistance" (Canadian, American Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,040, issued on Feb. 24, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Power via with reduced resistance" was invented by Richard T. Schultz (Fort Collins, Colo.) and Omid Rowhani (Markham, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and method for efficiently routing power signals across a semiconductor die. In various implementations, an integrated circuit includes, at a first node that receives a power supply reference, a first micro through silicon via (TSV) that traverses through a silicon substrate layer to a backside metal layer. The integrated circuit incl...