US Patent Issued to ADEKA on March 31 for "Curable resin composition and method for suppressing curing shrinkage of curable resin composition" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,178, issued on March 31, was assigned to ADEKA Corp. (Tokyo).

"Curable resin composition and method for suppressing curing shrinkage of curable resin composition" was invented by Takeshi Endo (Kitakyushu, Japan), Junji Ueyama (Kuki, Japan) and Ryo Ogawa (Kuki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1):wherein X is an oxygen atom or a sulfur atom; R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an aryl g...