US Patent Issued to ADEKA on Feb. 24 for "Indium compound, thin-film forming raw material, thin film, and method of producing same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,839, issued on Feb. 24, was assigned to ADEKA Corp. (Tokyo).

"Indium compound, thin-film forming raw material, thin film, and method of producing same" was invented by Keisuke Takeda (Tokyo) and Masaki Enzu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an indium compound, which is represented by the following general formula (1):where R1 and R2 each independently represent, for example, an unsubstituted alkyl group having 1 to 5 carbon atoms, R3 and R4 each independently represent, for example, a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, and A represents a group represented by the following general...