ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,483, issued on May 26, was assigned to ADEIA SEMICONDUCTOR TECHNOLOGIES LLC (San Jose, Calif.).
"Radio frequency device packages" was invented by Belgacem Haba (Saratoga, Calif.), Hong Shen (Palo Alto, Calif.), Patrick Variot (Los Gatos, Calif.) and Rajesh Katkar (Milpitas, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device package is disclosed. The integrated device package can include an antenna structure and an integrated device die electrically coupled to the antenna structure. The antenna structure can be formed with a system board or separated from the system board. When the antenna structure is formed with the system bo...