US Patent Issued to ADEIA SEMICONDUCTOR TECHNOLOGIES on Feb. 17 for "Methods for bonding semiconductor elements" (California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,615, issued on Feb. 17, was assigned to ADEIA SEMICONDUCTOR TECHNOLOGIES LLC (San Jose, Calif.).

"Methods for bonding semiconductor elements" was invented by Cyprian Emeka Uzoh (San Jose, Calif.) and Laura Wills Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are methods for direct bonding. In some embodiments, the direct bonding method includes microwave annealing a dielectric bonding layer of a first element by exposing the dielectric bonding layer to microwave radiation and then directly bonding the dielectric bonding layer of the first element to a second element without an intervening adhesive. The bondi...