ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,323, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Direct bonding methods and structures" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are processes and methods for direct bonding. In some embodiments, the process includes providing an element having a dielectric bonding surface and one or more conductive features exposed at the dielectric bonding surface, where the dielectric bonding surface has a planarity suitable for direct bonding. The process also includes, after providing the element, exposing the dielectric bondin...