US Patent Issued to Adeia Semiconductor Bonding Technologies on March 31 for "Testing elements for bonded structures" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,005, issued on March 31, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Testing elements for bonded structures" was invented by Belgacem Haba (Saratoga, Calif.) and Christopher Aubuchon (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure for testing a semiconductor device and a method for testing semiconductor devices is disclosed. The bonded structure may comprise a testing element and one or more semiconductor element. The testing element may comprise a testing circuitry. The testing element may be bonded to a semiconductor device or embedded within a semiconductor device. The te...