US Patent Issued to Adeia Semiconductor Bonding Technologies on March 17 for "Direct-bonded optoelectronic interconnect for high-density integrated photonics" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,994, issued on March 17, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Direct-bonded optoelectronic interconnect for high-density integrated photonics" was invented by Liang Wang (Newark, Calif.) and Rajesh Katkar (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Direct-bonded optoelectronic interconnects for high-density integrated photonics are provided. A combined electrical and optical interconnect enables direct-bonding of fully-processed optoelectronic dies or wafers to wafers with optoelectronic driver circuitry. The photonic devices may be III-V semiconductor devices. Direct-bonding to sil...