ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,488, issued on July 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Cavity packages" was invented by Shaowu Huang (Sunnyvale, Calif.), Javier A. DeLaCruz (San Jose, Calif.), Liang Wang (Milpitas, Calif.), Rajesh Katkar (Milpitas, Calif.) and Belgacem Haba (Saratoga, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disp...