US Patent Issued to Adeia Semiconductor Bonding Technologies on Feb. 24 for "Techniques for joining dissimilar materials in microelectronics" (North Carolina, California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,106, issued on Feb. 24, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Techniques for joining dissimilar materials in microelectronics" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.), Chandrasekhar Mandalapu (Morrisville, N.C.) and Laura Wills Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for joining dissimilar materials in microelectronics are provided. Example techniques direct-bond dissimilar materials at an ambient room temperature, using a thin oxide, carbide, nitride, carbonitride, or oxynitride intermediary with a thickness between 100-1000 nanometers. Th...