US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 4 for "Power distribution for stacked electronic devices" (California, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,064, issued on Aug. 4, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Power distribution for stacked electronic devices" was invented by Guilian Gao (San Jose, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked electronic device is disclosed. The stacked electronic device can comprise a die stack including two or more connected dies, such as a lower die, an upper die, and a middle die between the lower die and the upper die. A plurality of through substrate vias (TSVs) can provide signal transmission to dies of the sta...