US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on April 7 for "System and method for bonding transparent conductor substrates" (California, North Carolina Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,962, issued on April 7, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"System and method for bonding transparent conductor substrates" was invented by Jeremy Alfred Theil (Mountain View, Calif.), Cyprian Emeka Uzoh (San Jose, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Belgacem Haba (Saratoga, Calif.) and Rajesh Katkar (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element includes a substrate and a surface layer on the substrate. The surface layer includes at least one first region comprising an optically transparent and electrically insulative first material and at least one sec...