US Patent Issued to ACTRON TECHNOLOGY on Sept. 15 for "Semiconductor module having signal assembly in first and second molding compound" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,495, issued on Sept. 15, was assigned to ACTRON TECHNOLOGY Corp. (Taoyuan City, Taiwan).

"Semiconductor module having signal assembly in first and second molding compound" was invented by Hsin-Chang Tsai (Taoyuan City, Taiwan) and Ching-Wen Liu (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a substrate, at least one chip, at least one signal assembly, a first molding compound, and a second molding compound. The chip is disposed on the substrate and electrically connected to the substrate. The signal assembly is disposed on the substrate in a normal direction of the substrate and electrically con...