US Patent Issued to ACTRON TECHNOLOGY on May 26 for "Power semiconductor package signal connection component and semiconductor module" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,150, issued on May 26, was assigned to ACTRON TECHNOLOGY Corp. (Taoyuan City, Taiwan).

"Power semiconductor package signal connection component and semiconductor module" was invented by Hsin-Chang Tsai (Taoyuan City, Taiwan), Ching-Wen Liu (Taoyuan City, Taiwan) and Ting-Ling Chen (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package signal connection component includes a cylinder having a first through hole and two bases respectively disposed on opposite sides of the cylinder. Each base includes a continuous protrusion pattern and has a flat surface, a curved surface, and a second through hole. The flat s...