US Patent Issued to ABSOLICS on June 30 for "Substrate comprising a lid structure, package substrate comprising the same and semiconductor device" (South Korean, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,541, issued on June 30, was assigned to ABSOLICS INC..

"Substrate comprising a lid structure, package substrate comprising the same and semiconductor device" was invented by Sungjin Kim (Suwanee, Ga.) and Jincheol Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example embodiments provide a package substrate including a lid structure. The package substrate includes a substrate, a semiconductor element arranged on one surface of the substrate, and a lid surrounding at least a portion of the semiconductor element. The lid includes a region extending outwardly beyond the outer periphery of the substrate."

The patent was filed...