ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,650, issued on Sept. 22, was assigned to AaltoSemi Inc. (Nanjing City, China).
"Package substrate and fabricating method thereof" was invented by Min-Yao Chen (Nanjing City, China) and Andrew C. Chang (Nanjing City, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate is provided, in which a first circuit structure and a second circuit structure with the same specification are formed on opposite sides of a core board body, respectively, and a wiring structure of another specification is formed on the first circuit structure. In addition, the number of wiring layers of the second circuit structure is greater than the number of wi...