US Patent Issued to AaltoSemi on June 9 for "Electronic package, package substrate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,052, issued on June 9, was assigned to AaltoSemi Inc. (Nanjing City, China).

"Electronic package, package substrate and manufacturing method thereof" was invented by Andrew C. Chang (Nanjing City, China), Min-Yao Chen (Nanjing City, China) and Yin-Ju Chen (Nanjing City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which one of insulating layers inside a package substrate is made of an Ajinomoto build-up film (ABF) material to facilitate the production of circuit structures using a redistribution layer (RDL) process, so that a circuit layer can meet the needs of high-density fine lines/fine spacing."

The ...