US Patent Issued to AAC Microtech (Changzhou) on May 19 for "Speaker module housing and speaker module" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,609, issued on May 19, was assigned to AAC Microtech (Changzhou) Co. Ltd. (Changzhou, China).

"Speaker module housing and speaker module" was invented by Hailiang Gui (Changzhou, China), Jie Yuan (Changzhou, China) and Siyuan Ni (Changzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Speaker module housing and speaker module, the speaker module housing includes front shell with accommodating cavity and back cover fixed to front shell and covering accommodating cavity. Front shell has gate region for injection molding and fixed region opposite to gate region and away from gate region. Thickness of part of front shell between gate region and f...