ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,009, issued on Oct. 20, was assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co. LTD. (Shenzhen, China).
"Bone conduction microphone" was invented by Zhenkui Meng (Shenzhen, China) and Xing Yu (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure discloses a housing; a monolayer circuit board engaged with the housing for enclosing a receiving space, and including an acoustic channel; a vibration assembly received in the receiving space, dividing the receiving space into a first cavity and a second cavity; and a MEMS chip including a back cavity, received in the second cavity enclosed by the vibration assembly and the...