US Patent Issued to 3M Innovative Properties on June 16 for "Conductive patterns and methods thereof" (Minnesota, Wisconsin Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,326, issued on June 16, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Conductive patterns and methods thereof" was invented by Larry S. Hebert (Hudson, Wis.) and Scott A. Boyd (White Bear Lake, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electrically-conductive assembly and methods thereof. The electrically-conductive assembly includes a release liner having a major surface, a conductive layer extending across a portion of the major surface according to a pre-determined shape, a pressure-sensitive adhesive layer disposed between the release liner and the conductive layer. The pressure-sensitive adhesive lay...