US Patent Issued to 3M Innovative Properties on April 14 for "Electronic assembly comprising metal foil layer exposing solder bumps and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Electronic assembly comprising metal foil layer exposing solder bumps and method for fabricating the same" was invented by Jiwoong Kong (Gyeonggi-do, South Korea) and Jung Ju Suh (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an electronic assembly. Specifically, according to an embodiment of the present disclosure, there is provided an electronic assembly including: a circuit board including a plurality of electric conductive connectors; a plurality of spaced semiconductor integrated circuits coupled to a ...