US Patent Issued to 1FINITY on June 30 for "Module mounting device and information processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,263, issued on June 30, was assigned to 1FINITY Inc. (Kawasaki, Japan).

"Module mounting device and information processing apparatus" was invented by Nobuyuki Hayashi (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module mounting device includes a housing, a first panel provided over a front-end-side of the housing and to include first openings in which first and second electronic-modules are insertable, a first front-end-portion of the first electronic-module attached to the first panel while inserted in a first opening, a second panel provided behind the first panel, to include second openings in which the first and second elect...