US Patent Issued on Sept. 8 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,532, issued on Sept. 8.

"Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo), Shogo Sobue (Tokyo) and Saeko Ogawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes preparing a plurality of semiconductor elements, preparing a support member, attaching the plurality of semiconductor elements to the support member so that second surfaces of the plurality of semiconductor elements face the support member, encapsulating the plurality of semiconductor elements with an encapsulation material, removing the support member from an encapsu...