US Patent Issued on Sept. 8 for "Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction" (Minnesota Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,109, issued on Sept. 8.

"Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction" was invented by James Rathburn (Rogers, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments for a method of fabricating a printed circuit board are disclosed. A layer of liquid crystal polymer (LCP) having a first layer of copper on a first side thereof and a second layer of copper on a second side thereof is provided. The second layer of copper is 5 microns or less thick. The method includes disposing a resist overtop of the second copper layer and masking the resist to ...