US Patent Issued on Oct. 6 for "Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,730, issued on Oct. 6.

"Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration" was invented by Shun-Ping Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a die mounted on a substrate by flip-chip solder balls; an integrated heat spreader including a thin flexible foil and a supporter; a high temperature durable bonding material applied to the backside of the integrated heat spreader to bond the backside of the integrated heat spreader to the die; a heat sink fixed and attached to the heat sink supporter, wherein the backside of the heat sink ...