ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,805, issued on Oct. 20.
"Process and device for the spatially resolved localization of defects in materials" was invented by Sri Ranjini Arumugam (Leipzig, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A novel process allows defects in materials, in particular in solid bodies (18), to be localized with considerably higher spatial resolution than before. Defects can be quickly and economically imaged with high spatial resolution. It is possible to contactlessly spin-selectively excite and capture or image defects in the solid body with high sensitivity, high dynamic range, large field of view and excellent resolution, which far exceeds the p...