US Patent Issued on March 3 for "Method of manufacturing three-dimensional system-on-chip and three-dimensional system-on-chip" (Taiwanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,856, issued on March 3.

"Method of manufacturing three-dimensional system-on-chip and three-dimensional system-on-chip" was invented by Tzu-Wei Chiu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a three-dimensional system-on-chip, comprising providing a memory wafer structure with a first redistribution layer; disposing a first conductive structure and a core die structure and an input/output die structure with a second conductive structure on the first redistribution layer, the input/output die structure being disposed around the core die structure; forming a dielectric layer covering the core die structur...