US Patent Issued on March 24 for "Thin film thickness adjustments for three-dimensional interferometric measurements" (Israeli Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,733, issued on March 24.

"Thin film thickness adjustments for three-dimensional interferometric measurements" was invented by Nachum Yoav (Yavne, Israel), Yulia Lovsky (Yavne, Israel) and Ronen Levy (Yavne, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D surface map of a workpiece is determined using an interferometric quantitative phase imaging technique. The workpiece includes a transparent thin film or layers stack. The 3D surface map is corrected based on a thickness and a refractive index of the transparent thin film or layers stack. This technique can be used with an inspection system configured to perform an interferometric quanti...