US Patent Issued on March 17 for "Thermal management of three-dimensional integrated circuits" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,010, issued on March 17.

"Thermal management of three-dimensional integrated circuits" was invented by Kambiz Vafai (Mission Viejo, Calif.), Andisheh Tavakoli (Irvine, Calif.) and Mohammad Reza Salimpour (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, whe...