US Patent Issued on June 9 for "Method for manufacturing wiring board, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,762, issued on June 9.

"Method for manufacturing wiring board, and wiring board" was invented by Kei Togasaki (Tokyo), Kazuyuki Mitsukura (Tokyo), Masaya Toba (Tokyo), Kenichi Iwashita (Tokyo), Keishi Ono (Tokyo) and Mao Narita (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer; and forming a copper plating layer on the seed layer exposed into the opening by electr...