ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,517, issued on June 30.
"Method for producing semiconductor device, and expandable tape" was invented by Motoo Aoyama (Tokyo) and Masataka Nishida (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a semiconductor device includes: a step A of selecting an expandable tape including a base material film and a pressure-sensitive adhesive layer, the tape having a 90deg peel strength of the layer to a stainless plate larger than a 180deg peel strength; a step B of preparing a laminate including the tape and a plurality of semiconductor chips having first main surfaces; a step C of expanding intervals between the plurality of chi...