ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,102, issued on June 23.
"Method and apparatus for components with a reduced average roughness" was invented by John Othniel McDonald (Reno, Nev.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In an exemplary embodiment of the present invention: A series of U-shaped nickel-iron components are plated onto a rough or roughened semiconductor package or printed circuit board material. The horizontal base of the U-shaped component has a surface roughness of the semiconductor package material. The vertical surfaces of the U-shape have a surface roughness derived from the dry film. The large smooth vertical surface allows the U-shaped nickel-iron components...