ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,974, issued on June 16.
"Bonding method and a bonding apparatus for implementing the bonding method" was invented by Chuen-Fa Shih (Kaohsiung City, Taiwan), Chun-Hung Tsai (Kaohsiung City, Taiwan) and Yan-Zuo Chen (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method for using a bonding apparatus includes: transporting and reeling a carrier tape which is packaged with an adhering component, on a pressing assembly, and bending the carrier tape through a bending member to be divided into an input section and an output section; driving a roller to indirectly press and abut a front end of the adhering component to bring...