US Patent Issued on July 28 for "Integrated package and method for making the same" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,781, issued on July 28.

"Integrated package and method for making the same" was invented by ByungHyun Kwak (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated package and a method for making the same are provided. The integrated package includes: a first substrate including: a first interconnection area having a plurality of first interconnection structures; and a first alignment structure disposed outside the first interconnection area; a second substrate stacked above the first substrate and including: a second interconnection area having a plurality of second interconnection structures; and a second alignment struct...