US Patent Issued on Aug. 4 for "Heat spreader assembly for use with a semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,998, issued on Aug. 4.

"Heat spreader assembly for use with a semiconductor device" was invented by KyungEun Kim (Incheon, South Korea), YouJin Shin (Incheon, South Korea) and InWeon Ra (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a heat spreader assembly comprising: a pair of locking bars mounted on a substrate of a semiconductor device and at two opposite sides of at least one semiconductor die, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot; and a heat spreader comprising: a heat spreader body comprising a top portion and a pair of ...