ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,940, issued on Aug. 25.
"Wafer probing apparatus with probe card positioning module" was invented by Chien Wen Chang (Taoyuan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer probing apparatus is provided with a wafer probe station including a wafer chuck and a chuck movement device disposed under the wafer chuck and configured to move the wafer chuck in which a wafer is adhered to the wafer chuck; a lifting mechanism disposed close to the wafer probe station; a support frame provided with the lifting mechanism; at least one probe card positioning module disposed on the support frame, each probe card positioning module including a...